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3D stacked MEMS and ICs in a miniaturized sensor node

Abstract

Solutions for through silicon viasSolutions for interconnectsDemonstrator for e-CUBES

Category

Academic lecture

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Microsystems and Nanotechnology

Presented at

DTIP of MEMS and MOEMS

Place

Roma

Date

01.04.2009 - 03.04.2009

Year

2009

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