Abstract
Solutions for through silicon viasSolutions for interconnectsDemonstrator for e-CUBES
3D stacked MEMS and ICs in a miniaturized sensor node
Read publication
Category
Academic lecture
Language
English
Author(s)
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
DTIP of MEMS and MOEMS
Place
Roma
Date
01.04.2009 - 03.04.2009