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Conductive hydrophilic and hydrophobic high-temperature silicon direct wafer bonding

Conductive hydrophilic and hydrophobic high-temperature silicon direct wafer bonding

Category
Academic lecture
Client
  • Research Council of Norway (RCN) / 210601
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
  • University of South-Eastern Norway
Presented at
WaferBond'13
Place
Stockholm
Date
05.12.2013 - 06.12.2013
Organizer
Roy Knechtel, Frank Niklaus
Year
2013