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Die shear strength as a function of bond frame geometry – Au-Au thermo-compression bonding

Abstract

The die shear strength has been studied as a function of bond frame geometry for wafer-level Au-Au thermo-compression bonds. The shear strength of samples with a 100 and 200 μm wide bond frame (bond area 1 – 2 mm2) was higher and more uniform than that of samples with a 400 μm wide bond frame (bond area 4 mm2). Bond frames with rounded corners had higher bond strength than samples with right angled corners (strength increased by 10-20 %). Three different fracture modes were observed. These trends were supported by finite element analysis (FEA) simulations.
Conservative bonding parameters (temperature ≥ 400 °C, time ≥ 15 min, pressure 21 MPa) were applied to assure a uniform bond quality for the inspected samples. Shear testing as a method to quantify bond strength was discussed in general and in particular with respect to observed effects of bond frame geometries.

Category

Academic chapter/article/Conference paper

Client

  • Research Council of Norway (RCN) / 210601

Language

English

Author(s)

  • Torleif Andre Tollefsen
  • Andreas Larsson
  • Maaike Margrete Visser Taklo
  • Erik Poppe
  • Kari Schjølberg-Henriksen

Affiliation

  • University of South-Eastern Norway
  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Digital / Microsystems and Nanotechnology

Year

2012

Publisher

IEEE conference proceedings

Book

4th Electronics System-Integration Technology Conference (ESTC 2012)

ISBN

978-1-4673-4645-0

Page(s)

1 - 6

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