RFID Sensing and Interacting Technology Fusion
Communication TechnologiesSmart Integrated SystemsHybrid Sensor NetworksIntelliSense RFIDRFID Technology...
- Authors
- Ovidiu Vermesan
- Year
- 2008
- Type
- Conference lecture
Communication TechnologiesSmart Integrated SystemsHybrid Sensor NetworksIntelliSense RFIDRFID Technology...
...-ImaS (Intelligent Imaging Sensors) is a European project which has designed and developed a new adaptive X-ray imaging system using on-line exposure control, to create locally optimized images. The I-ImaS system allows for real-time image analysis during acquisition, thus enabling real-time...
Electronic Speckle Pattern Interferometry (ESPI) is used for optical non destructive testing based on interferometrical deformation measurement of the surface of an object. Low Coherence Interferometry (LCI), in particular Optical Coherence Tomography (OCT), are well established techniques for...
...• the R&D project The KUNNEworkplace 2003-2006 (shortly)• About My PhD-project (title: Boundary objects as a translation instrument), examples of instruments to use in the translation process from demand to supply, from words to architecture in briefing and design....
Nettverksmøte om arbeidsliv og familieliv...
This paper presents some related work on quality frameworks and requirements for evaluating them. It also discusses characteristics of model-driven engineering that are important when building a quality framework, such as its use of models in several stages of development and maintenance, generation...
The main objective of this report is to give an overview of progress on protective coatings for wind turbine blades, with focus on wear and erosion resistance, anti icing, anti soiling and salt resistance. Due to limited oil resources and climate problem, the demand for renewable energy is...
Quantifying and visualizing deformation and material fluxes is an indispensable tool for many geoscientific applications at different scales comprising for example global convective models (Burstedde et al., 2013), co-seismic slip (Leprince et al., 2007) or local slope deformation (Stumpf et al...
In this study, we explore the thermo-mechanical stress distribution of a chip/substrate BGA interconnect based on metal coated polymer spheres (MPS) of 30 μm diameter. The bonding of the chip to a glass substrate with MPS is obtained by deposition and sintering of a silver nanoparticle suspension...
What is CVL? History Language intro Chaos on standardization and its benefits and challenges Vanity Why are we doing this? why us? why do we think we can make this happen? Limitations standardization is not only technicalities The Future of CVL...