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Effect of Grain Orientation and Cooling Rate on Stress Distribution in a Small-scale Silicon Ingot

Effect of Grain Orientation and Cooling Rate on Stress Distribution in a Small-scale Silicon Ingot

Category
Conference lecture and academic presentation
Language
English
Author(s)
Affiliation
  • SINTEF Industry / Metal Production and Processing
  • Norwegian University of Science and Technology
  • Norwegian University of Science and Technology
Presented at
TMS Annual meeting
Place
San Diego, CA
Date
15.02.2014 - 19.02.2014
Organizer
TMS
Year
2014