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Conductive hydrophilic and hydrophobic high-temperature silicon direct wafer bonding

Conductive hydrophilic and hydrophobic high-temperature silicon direct wafer bonding

Category
Conference lecture and academic presentation
Client
  • Norges forskningsråd / 210601
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
  • University of South-Eastern Norway
  • University of South-Eastern Norway
Presented at
WaferBond'13
Place
Stockholm
Date
04.12.2013 - 05.12.2013
Organizer
Roy Knechtel, Frank Niklaus
Year
2013