Characterization of hermetic wafer-level Cu-Sn SLID bonding
Category
Academic lecture
Language
English
Author(s)
- Hubertus Johannes van de Wiel
- Astrid-Sofie Vardøy
- Gregory Hayes
- Hartmut R. Fischer
- Adriana Lapadatu
- Maaike Margrete Visser Taklo
Affiliation
- Unknown
- Netherlands Organisation for Applied Scientific Research
- SINTEF Digital / Smart Sensors and Microsystems
- SensoNor ASA
Presented at
4th Electronics system integration technologies conference (ESTC)
Place
Amsterdam
Date
17.09.2012 - 20.09.2012