Die shear strength as a function of bond frame geometry – Au-Au thermocompression bonding
Category
Conference lecture
Language
English
Author(s)
- Torleif Andre Tollefsen
- Andreas Larsson
- Maaike Margrete Visser Taklo
- Erik Poppe
- Kari Schjølberg-Henriksen
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- University of South-Eastern Norway
Presented at
4th Electronics System Integration Technologies Conference
Place
Amsterdam
Date
17.09.2012 - 20.09.2012
Year
2012View this publication at Norwegian Research Information Repository