At present two packages for IGBT devices are available for applications in the MW power range: the bonded power module and the press-pack housing. Power modules have been object of extensive research including their thermo-mechanical characterisation under variable operating conditions and the analysis of their failure mechanisms. These aspects have been critical to improve the manufacturing process, increase reliability and provide lifetime estimations. The press-pack package eliminates bonding wires and solder layers, and is claimed to offer improved power cycling lifetime. However, the knowledge on press-pack devices is much less mature with only limited data published in literature related to their thermo-mechanical behaviour. This paper presents results of FEM simulations on a full 3D model of a press pack IGBT under power-cycling conditions and during the clamping process. © 2012 Elsevier Ltd. All rights reserved.