Methods for characterization of wafer-level encapsulation applied on silicon to LTCC anodic bonding

Category

Academic article

Language

English

Author(s)

MF Khan
FA Ghavanini
S Haasl
L Lofgren
K Persson
C Rusu
Kari Schjølberg-Henriksen
P Enoksson

Affiliation

Chalmers University of Technology
Sweden
SINTEF Digital / Smart Sensors and Microsystems

Year

2010

Published in

Journal of Micromechanics and Microengineering (JMM)

ISSN

0960-1317

Publisher

IOP Publishing

Volume

20

Issue

6

DOI

https://doi.org/10.1088/0960-1317/20/6/064020

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