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Results from the first prototype of large 3D active edge sensors

Abstract

3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm2 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE-I4 readout electronics. Fabrication process and difficulties are presented and the preliminary electrical measurements are also discussed.

Category

Academic chapter

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems
  • University of Trento
  • National Institute of Nuclear Physics
  • Fondazione Bruno Kessler
  • Centro Nacional de Microelectrónica
  • University of Manchester
  • University of Hawaii at Hilo
  • SLAC National Accelerator Laboratory

Year

2012

Publisher

IEEE (Institute of Electrical and Electronics Engineers)

Book

2011 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC): Valencia, 23-29 Oct, 2011

ISBN

9781467301183

Page(s)

1319 - 1323

View this publication at Norwegian Research Information Repository