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Handbook of wafer bonding

Category

Academic anthology/Conference proceedings

Language

English

Author(s)

  • Peter Ramm
  • James Jian-Qiang Lu
  • Maaike Margrete Visser Taklo

Affiliation

  • Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
  • Rensselaer Polytechnic Institute
  • SINTEF Digital / Smart Sensors and Microsystems

Year

2012

Publisher

Wiley-VCH

ISBN

978-3-527-32646-4

View this publication at Cristin