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Wafer-level packaged MEMS switch with TSV

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Category

Conference lecture

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems
  • Norwegian Defence Research Establishment

Presented at

International Wafer-Level Packaging Conference

Place

Santa Clara

Date

03.10.2011 - 06.10.2011

Organizer

SMTA and ChipScale Review

Year

2011

View this publication at Norwegian Research Information Repository