Wafer-level packaged MEMS switch with TSV
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Category
Conference lecture
Language
English
Author(s)
- Nicolas Lietaer
- Thor Bakke
- Anand Summanwar
- Per G. Dalsjø
- Jakob Gakkestad
- Frank Niklaus
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- Norwegian Defence Research Establishment
Presented at
International Wafer-Level Packaging Conference
Place
Santa Clara
Date
03.10.2011 - 06.10.2011
Organizer
SMTA and ChipScale Review
Year
2011Read fulltext
https://hdl.handle.net/11250/2431338View this publication at Norwegian Research Information Repository