Effect of slurry parameters on material removal rate in multi-wire sawing of silicon wafers: a tribological approach
Category
Academic article
Language
English
Author(s)
- Gunstein Skomedal
- Eivind Johannes Øvrelid
- Sergio Armada Nieto
- Nuria Espallargas
Affiliation
- Norwegian University of Science and Technology
- SINTEF Industry / Materials and Nanotechnology
Year
2011Published in
Proceedings of the Institution of mechanical engineers. Part J, journal of engineering tribology
ISSN
1350-6501
Volume
225
Issue
J10
Page(s)
1023 - 1035