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Cathodic Debond of Anodically Bonded Silicon to Glass Wafers

Abstract

The bond quality of anodically bonded wafers was studied after
reversing the current through the bonded interface. After a cathodic
process the bond quality decreased with increasing reverse current. The
degradation of the bond depended on the glass quality and on the
original bond. Pyrex no. 7740 and Hoya SD-2 glass wafers were tested.

Category

Academic article

Language

English

Author(s)

  • Jose Antonio Plaza
  • E. González
  • Jaume Esteve
  • Maaike Margrete Visser Taklo
  • Dag Thorstein Wang
  • Anders Bror Hanneborg

Affiliation

  • Unknown
  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Digital / Microsystems and Nanotechnology
  • University of Oslo

Year

2000

Published in

Electrochemical and solid-state letters

ISSN

1099-0062

Volume

3

Issue

8

View this publication at Cristin