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Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw

Category

Academic article

Client

  • EC/H2020 / 609788

Language

English

Affiliation

  • SINTEF Industry / Sustainable Energy Technology
  • Norwegian University of Science and Technology
  • SINTEF Industry / Metal Production and Processing

Year

2020

Published in

Engineering Science and Technology, an International Journal (JESTECH)

ISSN

2215-0986

Publisher

Elsevier

Volume

23

Issue

5

Page(s)

1100 - 1108

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