Thermal management with a new encapsulation approach for a medical device
Category
Academic chapter/article/Conference paper
Client
- Research Council of Norway (RCN) / 245963
- Research Council of Norway (RCN) / 269618
Language
English
Author(s)
- Nu Bich Duyen Do
- Erik Andreassen
- Kristin Imenes
Affiliation
- University of South-Eastern Norway
- SINTEF Industry / Materials and Nanotechnology
Year
2020Publisher
IEEE (Institute of Electrical and Electronics Engineers)
Book
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
ISBN
978-1-7281-6293-5