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Thermal management with a new encapsulation approach for a medical device

Category

Academic chapter/article/Conference paper

Client

  • Research Council of Norway (RCN) / 245963
  • Research Council of Norway (RCN) / 269618

Language

English

Author(s)

Affiliation

  • University of South-Eastern Norway
  • SINTEF Industry / Materials and Nanotechnology

Year

2020

Publisher

IEEE

Book

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

ISBN

978-1-7281-6293-5

View this publication at Cristin