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Thermal management with a new encapsulation approach for a medical device

Thermal management with a new encapsulation approach for a medical device

Category
Academic chapter/article/Conference paper
Client
  • Research Council of Norway (RCN) / 245963
  • Research Council of Norway (RCN) / 269618
Language
English
Author(s)
Affiliation
  • University of South-Eastern Norway
  • SINTEF Industry / Materials and Nanotechnology
Year
Publisher
IEEE
Book
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
ISBN
978-1-7281-6293-5