Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres
Category
Academic chapter
Language
English
Author(s)
- Daniel Nilsen Wright
- Branson Belle
- Joachim Seland Graff
Affiliation
- SINTEF Industry / Sustainable Energy Technology
- SINTEF Digital / Smart Sensors and Microsystems
Year
2019Publisher
IEEE (Institute of Electrical and Electronics Engineers)
Book
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
ISBN
9780956808660
View this publication at Norwegian Research Information Repository