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Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres

Category

Academic chapter

Language

English

Author(s)

Affiliation

  • SINTEF Industry / Sustainable Energy Technology
  • SINTEF Digital / Smart Sensors and Microsystems

Year

2019

Publisher

IEEE (Institute of Electrical and Electronics Engineers)

Book

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

ISBN

9780956808660

View this publication at Norwegian Research Information Repository