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Molecular Dynamics Simulation of Heat Transfer at Contact Interface of Hot Forming Die

Molecular Dynamics Simulation of Heat Transfer at Contact Interface of Hot Forming Die

Category
Academic article
Language
English
Author(s)
Affiliation
  • Jiangsu University
  • SINTEF Industry / Metal Production and Processing
Year
Published in
IOP Conference Series: Materials Science and Engineering
ISSN
1757-8981
Volume
627
Issue
1