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Liquid Solid Diffusion (LSD) bonding: A novel joining technology

Abstract

Liquid Solid Diffusion (LSD) bonding is a novel joining technology forming solid and liquid two-phase field joints from simple binary systems. LSD creates joints that are applicable at temperatures above the melting temperature of the material composition of the initial bond. Liquid and solid inter-diffusion transform the joint composition and microstructure. The final joint is characterized by incongruent re-melting forming a coherent continuous porous solid solution phase with liquefied pores. This article briefly describes the methodology and presents experimental results based on the Au-Ge system. High quality joints were created. The effective melting point was increased by more than 200 °C above the initial eutectic melting point of the system.

Category

Academic chapter

Language

English

Author(s)

Affiliation

  • SINTEF Industry / Sustainable Energy Technology
  • University of South-Eastern Norway
  • Techni AS
  • Diverse norske bedrifter og organisasjoner

Year

2018

Publisher

IEEE (Institute of Electrical and Electronics Engineers)

Book

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

ISBN

9781538623091

View this publication at Norwegian Research Information Repository