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Miniature, low-cost, 200 mW, infrared thermal emitter sealed by wafer-level bonding

Category

Academic lecture

Client

  • Research Council of Norway (RCN) / 247781

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Microsystems and Nanotechnology
  • SINTEF Digital / Smart Sensor Systems

Presented at

Photonics West - OPTO

Place

San Fransisco

Date

27.01.2017 - 01.02.2017

Organizer

SPIE - International Society for Optics and Photonics

Year

2017

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