Engineering interconnect and package properties by application of nanotechnology
Category
Lecture
Language
English
Author(s)
- Sen Mei
- Christian Rone Simon
- Maaike Margrete Visser Taklo
Affiliation
- SINTEF Industry / Materials and Nanotechnology
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
IEEE CPMT workshop on nanoscale electronics packaging
Place
Gothenburg
Date
09.06.2015 - 10.06.2015
Organizer
Chalmers Univeristy