Low Temperature All-Copper Interconnects by Nanoparticle Assembly and Sintering
Category
Academic lecture
Language
English
Author(s)
- Thomas Brunschwiler
- Jonas Zürcher
- Gerd Schlottig
- Tobias Mills
- Paul Reip
- Maaike Margrete Visser Taklo
- Astrid-Sofie Vardøy
- Daniel Nilsen Wright
- Mario Baum
- Sridhar Kumar
- Uwe Zschenderlein
- Bernhard Wunderle
Affiliation
- Unknown
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
The Global Interposer Technology 2015 Workshop
Place
Atlanta, GA
Date
04.11.2015 - 07.11.2015
Organizer
Georgia Tech Packaging Research Center