Grain structure of Aluminium films for wafer-level thermocompression bonding
Category
Conference lecture
Language
English
Author(s)
- Nishant Malik
- Vishnukanthan Venkatachalapathy
- Erik Poppe
- Kari Schjølberg-Henriksen
- Maaike Margrete Visser Taklo
- Terje Finstad
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- University of Oslo
Presented at
WaferBond
Date
07.12.2015 - 09.12.2015
Year
2015View this publication at Norwegian Research Information Repository