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Qualification and applications of a piezoelectric MEMS process

Abstract

An industrializable process for manufacturing of piezoelectric ultrasound transducer elements is demonstrated. The PZT film is deposited by chemical solution deposition on SOI wafers, and standard MEMS processes are utilized to make cantilevers, bridges and membranes. The PZT film of ~50% of the devices exposed to thermal aging were found to fail at 85°C – 85%RH (relative humidity), while a real-life test of 8·1010 cycles at resonance only gives a slight change in Q-value and resonance frequency.

Category

Academic chapter/article/Conference paper

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Microsystems and Nanotechnology
  • SINTEF Industry / Materials and Nanotechnology

Year

2007

Publisher

IEEE

Book

International Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007, Lyon 10-14 June, 2007

ISBN

1424408423

Page(s)

529 - 532

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