Abstract
Solutions for through silicon viasSolutions for interconnectsDemonstrator for e-CUBES
3D stacked MEMS and ICs in a miniaturized sensor node
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Category
Conference lecture
Language
English
Author(s)
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
DTIP of MEMS and MOEMS
Place
Roma
Date
01.04.2009 - 03.04.2009
Year
2009Read fulltext
https://hdl.handle.net/11250/2429947View this publication at Norwegian Research Information Repository