To main content

Hermeticity and Reliability of Al-Al Thermocompression Wafer Bonding

Category

Conference lecture

Language

English

Author(s)

  • Nishant Malik
  • Erik Poppe
  • Kari Schjølberg-Henriksen
  • Maaike Margrete Visser Taklo
  • Terje Finstad

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems
  • University of Oslo

Presented at

The 226th Meeting of the Electrochemical Society

Place

Cancun

Date

05.10.2014 - 09.10.2014

Organizer

The Electrochemical Society

Year

2014

View this publication at Norwegian Research Information Repository