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Bond strength of conductive Si-Si bonded seals

Category

Academic chapter/article/Conference paper

Client

  • Research Council of Norway (RCN) / 210601

Language

English

Author(s)

  • Kari Schjølberg-Henriksen
  • Lars Geir Whist Tvedt
  • Sigurd T. Moe
  • Erik Poppe
  • Dag Thorstein Wang
  • Stein Are Gjelstad
  • Christopher Mørk
  • Kristin Imenes

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems
  • University of South-Eastern Norway

Year

2014

Publisher

EDA Publishing Association

Book

Symposium on Design, test, Integration & Packaging of MEMS/MOEMS, Cannes, France, 1-4 April, 2014

ISBN

9782355000287

Page(s)

312 - 317

View this publication at Cristin