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Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs

Category

Conference lecture

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems

Presented at

DTIP

Place

Cannes

Date

01.04.2014 - 04.04.2014

Organizer

CMP

Year

2014

View this publication at Norwegian Research Information Repository