Optimization of Al-Al thermocompression bonding
Category
Conference poster
Language
English
Author(s)
- Nishant Malik
- Kari Schjølberg-Henriksen
- Erik Poppe
- Maaike Margrete Visser Taklo
- Terje Finstad
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- University of Oslo
Presented at
WaferBond'13
Place
Stockholm
Date
05.12.2013 - 06.12.2013
Organizer
Roy Knechtel, Frank Niklaus
Year
2013View this publication at Norwegian Research Information Repository