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Wafer-level Au-Au thermocompression bonding for hermetic device sealing

Category

Academic lecture

Client

  • Research Council of Norway (RCN) / 210601

Language

English

Author(s)

  • Hannah Rosquist Tofteberg
  • Kari Schjølberg-Henriksen
  • Eivind Johan Fasting
  • Alexander Stene Moen
  • Maaike Margrete Visser Taklo
  • Erik Poppe
  • Christian Julius Simensen

Affiliation

  • SINTEF Digital / Microsystems and Nanotechnology
  • OsloMet - Oslo Metropolitan University
  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Industry / Sustainable Energy Technology

Presented at

Micromechanics Europe

Place

Espoo

Date

01.09.2013 - 04.09.2013

Year

2013

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