Al-Al thermocompression bonding for wafer-level MEMS packaging
Category
Academic lecture
Client
- Research Council of Norway (RCN) / 210601
Language
English
Author(s)
- Nishant Malik
- Kari Schjølberg-Henriksen
- Erik Poppe
- Terje Finstad
Affiliation
- University of Oslo
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
17th International Solid-State Sensors, Actuators and Microsystems Conference (Transducers)
Place
Barcelona
Date
16.06.2013 - 20.06.2013
Organizer
IEEE