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Al-Al thermocompression bonding for wafer-level MEMS packaging

Category

Academic lecture

Client

  • Research Council of Norway (RCN) / 210601

Language

English

Author(s)

  • Nishant Malik
  • Kari Schjølberg-Henriksen
  • Erik Poppe
  • Terje Finstad

Affiliation

  • University of Oslo
  • SINTEF Digital / Microsystems and Nanotechnology

Presented at

17th International Solid-State Sensors, Actuators and Microsystems Conference (Transducers)

Place

Barcelona

Date

16.06.2013 - 20.06.2013

Organizer

IEEE

Year

2013

View this publication at Cristin