Al-Al thermocompression bonding for wafer-level MEMS packaging
Category
Conference lecture
Language
English
Author(s)
- Nishant Malik
- Kari Schjølberg-Henriksen
- Erik Poppe
- Terje Finstad
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- University of Oslo
Presented at
17th International Solid-State Sensors, Actuators and Microsystems Conference (Transducers)
Place
Barcelona
Date
16.06.2013 - 20.06.2013
Organizer
IEEE
Year
2013View this publication at Norwegian Research Information Repository