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Au-Sn SLID bonding: A reliable HT interconnect and die attach technology

Abstract

Au-Sn solid–liquid interdiffusion (SLID) bonding is an established reliable high temperature (HT) die attach and interconnect technology. This article presents the life cycle of an optimized HT Au-Sn SLID bond, from fabrication, via thermal treatment, to mechanical rupture. The layered structure of a strong and uniform virgin bond was identified by X-ray diffraction to be Au/ζ (Au0.85Sn0.15)/Au. During HT exposure, it was transformed to Au/β (Au1.8Sn0.2)/Au. After HT exposure, the die shear strength was reduced by 50 pct, from 14 Pa to 70 MPa, which is still remarkably high. Fractographic studies revealed a change in fracture mode; it was changed from a combination of adhesive Au/Ni and cohesive SiC fracture to a cohesive β-phase fracture. Design rules for high quality Au-Sn SLID bonds are given.

Category

Academic article

Client

  • Research Council of Norway (RCN) / 193108
  • Research Council of Norway (RCN) / 193108/S60

Language

English

Author(s)

  • Torleif Andre Tollefsen
  • Andreas Larsson
  • Maaike Margrete Visser Taklo
  • Antonia Neels
  • Xavier Maeder
  • Kristin Høydalsvik
  • Dag Werner Breiby
  • Knut E. Aasmundtveit

Affiliation

  • University of South-Eastern Norway
  • SINTEF Digital / Smart Sensor Systems
  • Swiss Center for Electronics and Microtechnology Inc.
  • Norwegian University of Science and Technology

Year

2013

Published in

Metallurgical and Materials Transactions B

ISSN

1073-5615

Publisher

Springer

Volume

44

Issue

2

Page(s)

406 - 413

View this publication at Cristin