The harsh environment packaging team focuses on packaging solutions for high reliability and high performance applications such as for downhole, subsea, automotive, geothermal, air & space industries.
Our department has a long pedigree for developing reliable instrumentation system for harsh environments. Our competence in state-of-art packaging solutions has been key for this success. We can support, define and develop suitable technologies and solutions for e.g. interconnects, ceramic circuit boards, encapsulations and thermal management solutions.