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Demanding environments

The harsh environment packaging team focuses on packaging solutions for high reliability and high performance applications such as for downhole, subsea, automotive, geothermal, air & space industries.

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A concept for a power controller for a brushless DC motor for downhole applications (400 V, 5 A, 3.1 kVA @ 250 °C for 6000 h) [Larsson and Tollefsen, HiTEC 2012]

Our department has a long pedigree for developing reliable instrumentation system for harsh environments. Our competence in state-of-art packaging solutions has been key for this success. We can support, define and develop suitable technologies and solutions for e.g. interconnects, ceramic circuit boards, encapsulations and thermal management solutions.