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Demanding environments

Demanding environments

Research Manager
934 98 279

The harsh environment packaging team focuses on packaging solutions for high reliability and high performance applications such as for downhole, subsea, automotive, geothermal, air & space industries.

A concept for a power controller for a brushless DC motor for downhole applications (400 V, 5 A, 3.1 kVA @ 250 °C for 6000 h) [Larsson and Tollefsen, HiTEC 2012]

Our department has a long pedigree for developing reliable instrumentation system for harsh environments. Our competence in state-of-art packaging solutions has been key for this success. We can support, define and develop suitable technologies and solutions for e.g. interconnects, ceramic circuit boards, encapsulations and thermal management solutions.