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Kari Anne Hestnes Bakke

Senior Research Scientist

Kari Anne Hestnes Bakke

Senior Research Scientist

Kari Anne Hestnes Bakke
Phone: 930 35 312
Email:
Unit: SINTEF Digital
Department: Smart Sensor Systems
Office: Oslo

Publications and responsibilities

Publication

INLINE SPECTROSCOPY: THE JOURNEY FROM CONCEPT TO FUNCTION

https://www.sintef.no/en/publications/publication/?pubid=1697437

The field of applied spectroscopy is strongly dominated by publications presenting proof-of-concepts, lab set-ups, and demonstrations. In contrast, the corresponding number of commercial successes of inline spectroscopy is surprisingly lower. This article discusses inline spectroscopy from an...

Authors Marion O Farrell Jon Tschudi Kari Anne Hestnes Bakke
Year 2019
Type Academic lecture
Publication

Inline spectroscopy: From concept to function

https://www.sintef.no/en/publications/publication/?pubid=1600099

The field of applied spectroscopy is strongly dominated by publications presenting proof-of-concepts, lab set-ups, and demonstrations. In contrast, the corresponding number of commercial successes of inline spectroscopy is surprisingly lower. This article discusses inline spectroscopy from an...

Authors Jon Tschudi Marion O Farrell Kari Anne Hestnes Bakke
Year 2018
Type Academic literature review
Publication

Design tool for TOF and SL based 3D cameras

https://www.sintef.no/en/publications/publication/?pubid=1510497

Active illumination 3D imaging systems based on Time-of-flight (TOF) and Structured Light (SL) projection are in rapid development, and are constantly finding new areas of application. In this paper, we present a theoretical design tool that allows prediction of 3D imaging precision. Theoretical...

Authors Grégory Bouquet Jostein Thorstensen Kari Anne Hestnes Bakke Petter Risholm
Year 2017
Type Academic article
Publication

Miniature, low-cost, 200 mW, infrared thermal emitter sealed by wafer-level bonding

https://www.sintef.no/en/publications/publication/?pubid=1454849

Infrared (IR) thermal emitters are widely used in monitoring applications. For autonomous systems, miniaturized devices with low power consumption are needed. We have designed, fabricated and tested a novel device design, packaged on the wafer level by Al-Al thermo-compression bonding. 80 μm wide...

Authors Kari Schjølberg-Henriksen Jo Gjessing Kari Anne Hestnes Bakke Sanja Hadzialic Dag Thorstein Wang
Year 2017
Type Academic chapter/article/Conference paper
View all publications at Cristin