Publications
- Effect of Concentration of Lithium Bis(fluorosulfonyl)imide on the Performance of Silicon Anodes for Li-Ion Batteries Read the publication
- Mitigating Silicon Amorphization in Si–Gr Anodes: A Pathway to Stable, High-Energy Density Anodes for Li-Ion Batteries Read the publication
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Performance-optimized diatom-SiO
x anodes for Li-ion batteries by preserving the nanostructured SiO2 shells of diatom microalgae and tailoring oxygen content Read the publication - Revisiting Mechanism of Silicon Degradation in Li-Ion Batteries: Effect of Delithiation Examined by Microscopy Combined with ReaxFF Read the publication
- Uni-Axial Densification of Slurry-Casted Li₆PS₅Cl Tapes: The Role of Particle Size Distribution and Densification Pressure
- Nanostructured NiCoFeCr alloy with superior high-temperature irradiation resistance
- In-situ Microscale Cold Welding using a Focused Ion Beam-Scanning Electron Microscope
- Enabling the use of lithium bis(trifluoromethanesulfonyl)imide as electrolyte salt for Li-ion batteries based on silicon anodes and Li(Ni0.4Co0.4Mn0.2)O2 cathodes by salt additives Read the publication
- Two-Dimensional Heterostructure Complementary Logic Enabled by Optical Writing
- Atomic resolution transmission electron microscopy visualisation of channel occupancy in beryl in different crystallographic directions Read the publication
Other
- TEM studies of Nanostructure in Aluminium-Copper Welds made by Solid State Joining
- Artificial vs. natural graphite
- In-Situ Studies of Conventional and Microscale FIB-assisted Methods for Cold Welding of Dissimilar Conductive Materials Read the publication
- Electrons and ions –use cases like FIB-SEM tomography and TEM lamellae
- Characterisation of the microstructure in Al/Cu joints welded using hybrid metal extrusion & bonding
- SiOx Li-ion battery anodes produced from reduced diatom frustules
- Microstructural characterisation of Al/Cu joints welded using hybrid metal extrusion & bonding
- 2D world in the Softcom lab – graphene, clay and beyond
- LARGE BAND GAP OF INSULATOR CLAY NANOSHEETS
- Observation of Al-Cu interface instability in a HYB joint TEM sample during room temperature storage