Laboratories
Publications
- Wafer bonding process for zero level vacuum packaging of MEMS Read the publication
- Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks Read the publication
- Vertical Interconnects for High-End MEMS
- Al-Al Wafer-Level Thermocompression Bonding applied for MEMS Read the publication
- Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding Read the publication
- Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints Read the publication
- Conductivity of high-temperature annealed silicon direct wafer bonds Read the publication
- Non-destructive wafer-level bond defect identification by scanning acoustic microscopy Read the publication
- Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding
- Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints
Other
- 'Spotting & Bonding' - A novel method for Multi stack, Wafer -level bonding of PiezoMEMS devices
- 'Spotting & Bonding' - A novel method for Multi stack, Wafer -level bonding of PiezoMEMS devices
- INTEGRATION OF THIN FILM ELECTRODES IN MICROFLUIDIC ELECTROCHEMICAL CELLS
- MICROFABRICATED ELECTROSPRAY INTERFACES FOR SENSITIVE BIONANALYSES
- Microfluidic Nanospray Emitters with a Liquid Junction for Sensitive Bioanalyses
- MICROFLUIDIC ELECTROCHEMICAL SURFACE-ENHANCED RAMAN SCATTERING SENSORS FOR DETECTION OF PESTICIDES IN SURFACE WATERS
- NANOSPRAY EMITTERS: MICROFABRICATED ELECTROSPRAY INTERFACES (ESI) WITH A LIQUID JUNCTION FOR SENSITIVE BIONANALYSES
- MICROFLUIDIC INTEGRATION OF ELECTROCHEMICAL SURFACE-ENHANCED RAMAN SCATTERING SENSORS FOR DETECTION OF PESTICIDES IN SURFACE WATERS
- Technological aspects of devices for efficient ion concentration polarization and electro-driven separation with ultra-shallow nanochannels
- A Novel Method for Depositing Patterned BCB using Spotter for Low Temperature Wafer Level Bonding