Abstract
Surface adhesion between wet wafers poses great challenges for silicon wafer handling. It has been shown that both the shear and normal handling forces of the solar silicon wafers can be dramatically reduced by using the ultrasound energy. Approximately 20 and 5 times reduction in horizontal and vertical forces were achieved by as low power as 10 W, and a good agreement was found between the measured values and the predictions of a simple model for the effect of longitudinal vibration we developed.