Development of low modulus conductive adhesive for MEMS interconnects

Category

Academic chapter/article/Conference paper

Language

English

Author(s)

Helge Kristiansen
Maaike Margrete Visser Taklo
Thor Bakke
Rolf Johannessen
Frøydis Oldervoll
Jakob Gakkestad
Per Dalsjø
Hoang Vu Nguyen

Affiliation

Conpart AS
SINTEF Digital / Smart Sensors and Microsystems
Unknown
Norwegian Defence Research Establishment
University of South-Eastern Norway

Year

2009

Publisher

Curran Associates, Inc.

Book

14th Pan Pacific Microelectronics Symposium and Tabletop Exhibition 2009

ISBN

978-1-60560-984-3

Page(s)

306 - 310

View this publication at Cristin