Development of low modulus conductive adhesive for MEMS interconnects
Category
Academic chapter
Language
English
Author(s)
- Helge Kristiansen
- Maaike Margrete Visser Taklo
- Thor Bakke
- Rolf Johannessen
- Frøydis Oldervoll
- Jakob Gakkestad
- Per Dalsjø
- Hoang Vu Nguyen
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- University of South-Eastern Norway
- Conpart AS
- Norwegian Defence Research Establishment
Year
2009Publisher
Curran Associates, Inc.
Book
14th Pan Pacific Microelectronics Symposium and Tabletop Exhibition 2009
ISBN
9781605609843
Page(s)
306 - 310
View this publication at Norwegian Research Information Repository