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High temperature bonding technology for SiC devices – Au-Sn SLID

Category

Academic lecture

Language

English

Author(s)

  • Torleif Andre Tollefsen
  • Andreas Larsson
  • Knut E. Aasmundtveit

Affiliation

  • University of South-Eastern Norway
  • SINTEF Digital / Smart Sensors and Microsystems

Presented at

Berkeley Sensor and Actuator Center seminar

Place

Berkeley

Date

25.10.2011 - 25.10.2011

Organizer

University of California Berkeley

Year

2011

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