High temperature bonding technology for SiC devices – Au-Sn SLID
Category
Conference lecture
Language
English
Author(s)
- Torleif Andre Tollefsen
- Andreas Larsson
- Knut E. Aasmundtveit
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- University of South-Eastern Norway
Presented at
Berkeley Sensor and Actuator Center seminar
Place
Berkeley
Date
25.10.2011 - 25.10.2011
Organizer
University of California Berkeley
Year
2011View this publication at Norwegian Research Information Repository