Bonding and TSV in 3D IC Integration: Physical Analysis with a Plasma FIB

Category

Popular science article

Language

English

Author(s)

Maaike Margrete Visser Taklo
Armin Klumpp
Peter Ramm
Laurens Kwakman
German Franz

Affiliation

SINTEF Digital / Smart Sensors and Microsystems

Year

2011

Published in

Microscopy and Analysis

ISSN

0958-1952

Volume

25

Issue

7

Page(s)

9 - 12

View this publication at Norwegian Research Information Repository