Methods for characterization of wafer-level encapsulation applied on silicon to LTCC anodic bonding

Category

Academic article

Language

English

Author(s)

MF Khan
FA Ghavanini
S Haasl
L Lofgren
K Persson
C Rusu
Kari Schjølberg-Henriksen
P Enoksson

Affiliation

SINTEF Digital / Smart Sensors and Microsystems
Sweden
Chalmers University of Technology

Year

2010

Published in

Journal of Micromechanics and Microengineering (JMM)

ISSN

0960-1317

Volume

20

Issue

6

DOI

https://doi.org/10.1088/0960-1317/20/6/064020

View this publication at Norwegian Research Information Repository