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Investigation of Compliant Interconnect for Ball Grid Array (BGA)

Category

Academic chapter

Language

English

Author(s)

  • Rolf Johannessen
  • Frøydis Oldervoll
  • Helge Kristiansen
  • Hallvard Tyldum
  • Hoang-Vu Nguyen
  • Knut Eilif Aasmundtveit

Affiliation

  • SINTEF
  • Norwegian University of Science and Technology
  • University of South-Eastern Norway

Year

2009

Publisher

International Microelekctroncis and Packaging Society Italian Chapter

Book

Microelectronics and Packaging Conference, 2009. EMPC 2009. European

ISBN

9781424447220

View this publication at Norwegian Research Information Repository