Abstract
The following sections are included:
•Introduction
•Through Glass Vias (TGVs)
•Through Silicon Vias
•Summary
•References
•Introduction
•Through Glass Vias (TGVs)
•Through Silicon Vias
•Summary
•References
Vertical Interconnects for High-End MEMS
Category
Academic chapter
Language
English
Author(s)
- Sigurd Moe
- Maaike Margrete Visser Taklo
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Year
2018Publisher
World Scientific
Book
MEMS Packaging
ISBN
9789813229358
Page(s)
45 - 52
View this publication at Norwegian Research Information Repository