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Bending Machine for Testing Reliability of Flexible Electronics

Category

Conference lecture

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems

Presented at

NordPac conference 2017

Place

Gøteborg

Date

19.06.2017 - 20.06.2017

Organizer

IMAPS Nordic and IEEE Nordic

Year

2017

View this publication at Norwegian Research Information Repository