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Miniature, low-cost, 200 mW, infrared thermal emitter sealed by wafer-level bonding

Category

Conference lecture

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems

Presented at

Photonics West - OPTO

Place

San Fransisco

Date

27.01.2017 - 01.02.2017

Organizer

SPIE - International Society for Optics and Photonics

Year

2017

View this publication at Norwegian Research Information Repository