To main content

Low-Temperature Aluminum-Aluminum Wafer Bonding

Category

Conference lecture

Language

English

Author(s)

  • Bernhard Rebhan
  • Andreas Hinterreiter
  • Nishant Malik
  • Kari Schjølberg-Henriksen
  • Viorel Dragoi
  • Kurt Hingerl

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems
  • Johannes Kepler University Linz
  • University of Oslo

Presented at

PRiME 2016/230th ECS Meeting

Place

Honolulu

Date

02.10.2016

Organizer

The Electrochemical Society

Year

2016

View this publication at Norwegian Research Information Repository